What processing method is used for lead frame

What is a lead frame? It mainly consists of two parts: chip pads and pins. Lead frame is the frame that links the contact points and external wires, and it acts as a bridge between external wires. It is the chip carrier of integrated circuits. Most semiconductor integrated blocks contain lead frames, which are the main basic materials in the electronic information industry.

The lead frame and packaging materials play the role of fixing the chip to protect the internal components, transmitting electrical signals and radiating the heat of the components to the outside. The main materials are copper alloy and stainless steel series, and the materials with high conductivity, high strength, high functional tensile strength above 600MPa, electrical conductivity above 80% and softening resistance above 500℃ are preferred.

At present, the main processing methods of lead frame are stamping and etching, and there is a big difference between them. The die cycle of stamping lead frame is long, so it can't produce multiple lead frames, and the ultra-thin processing can't be carried out by stamping, which is easy to deform. However, stamping lead frames on mass production and products with bumps can be completed well. Etching the lead frame makes up for the disadvantage that stamping can't achieve ultra-thinness. For example, a 0.2MM lead frame can be etched for multi-pins, but the lead frame with a thickness higher than 2.0 can't be etched. The surface of the lead frame processed by etching will not produce burrs, and ultra-thin products are not easy to deform.

Therefore, the choice of processing lead frame is mainly determined according to the user's actual use scene requirements. Etching is the higher requirement, and stamping can be used for products without too high requirement.