Etch processing of ceramic copper clad laminate

Ceramic copper clad laminate has extremely high product advantages, such as high thermal conductivity and low expansion coefficient, low thermal resistance, which can improve the working efficiency and service life of semiconductor chips, good flatness and surface smoothness, good stability in high temperature environment, high thermal shock resistance, high insulation and withstand voltage, and strong current conduction ability.

The main materials used in ceramic copper clad laminate are brass plate, phosphor copper plate, beryllium copper plate, red copper plate and red copper plate. The ceramic copper-clad heat dissipation substrate on high-power LED is mainly used for Chip package or COB module package of low-power multi-chip integration process. The LED ceramic copper-clad plate is mainly a composite material bonded with copper foil by high-temperature process, using chemical etching process, and also cutting the shape of the circuit board material by laser, punching, chemical plating, etc.