Advantages of ceramic copper etching processing

With the continuous development of integrated circuits, the development of ceramic clad plate technology is promoted by the continuous miniaturization and high performance technology growth of electronic products. Among them, ceramic aluminum-clad plate and ceramic copper-clad plate are the basic materials of high-power power electronic circuit interconnection technology and structural technology. The etching process of ceramic aluminum-clad copper plate is a technology to remove materials through chemical corrosion reaction or physical impact. The etching processing technology can be divided into wet etching and dry etching. Ceramic copper clad laminate is composed of ceramic substrate, bonding layer and conductive layer. Copper foil is directly bonded at high temperature or soldered to alumina or aluminum nitride ceramic substrate by active metal brazing. The ultra-thin composite substrate has high thermal conductivity, high adhesion strength, excellent solderability and excellent electrical insulation. The common thickness of ceramic copper-clad plate processed by etching is 0.08MM, 0.1MM, 0.2MM, 0.25MM, 0.3MM, 0.5MM, 0.7MM and 0.8MM respectively, which is the basic material of electronic industry, mainly used for processing and manufacturing printed circuit boards, and widely used in electronic products such as televisions, radios, computers and mobile communications.

Etching of ceramic copper clad laminate has the following advantages:

1. Low mold opening cost, the metal film can be drawn within two hours, and the mold with any shape can be changed, thus reducing the design and development cost.

2. Etching molybdenum mesh can ensure extremely high precision, and the highest precision can reach +/-0.01mm, which can meet the precision of different parts.

Correct assembly and filtering requirements, improve product quality and accuracy.

3. Any etched products with complex shapes can also be produced in batches with good quality and quantity, and the unit price of etched ceramic copper clad laminate is not affected.

4. The etched ceramic copper clad laminate has no burr and pressure point, and the product is not deformed and the material properties are not changed.

5. The ceramic copper clad laminate produced by chemical etching process can achieve the ceramic copper clad laminate products that traditional stamping or sheet metal machining cannot achieve.