Advantages of Metal Develoable Alloy Packaging Cover Etching Processing

Metal deformable encapsulation cover in communication equipment, microwave devices, equipment, hybrid collectors, industrial lasers and other encapsulation, due to thermal expansion by the series of alloys processed, also known as deformable alloys, the main material is the 4J29, 4J42 material, with ceramics close to the coefficient of linear expansion, the scope of application is mainly used in crystal resonators, oscillators, surface acoustic filters (SAW), IC The applications are mainly for crystal resonators, oscillators, SAW filters, ICs, etc..

Metal deharpable encapsulation cover has quite strong advantages by etching process, etching metal deharpable encapsulation cover has high dimensional accuracy, smooth and even surface, uniform surface plating, corrosion resistance, salt spray resistance; In the field of optical communication, deharpable alloy encapsulation cover can be encapsulated with single chip and multi-chip, has compact volume and structure, high efficiency of photoelectric conversion, stable performance, high reliability, It has the advantages of compact size and structure, high photoelectric conversion efficiency, stable performance, high reliability, long life and easy installation. It can effectively provide electrical signal transmission channel and optical coupling interface for the device, and solve the role of connecting the chip and external circuit.

Develoable alloy encapsulation metal cover etching can effectively guarantee the performance of the product material, etching develoable alloy cover thickness can be selected between 0.01MM-2MM thickness, so it can be selected in more areas. Develoable alloy cover etching processing with chemical corrosion processing production, mass production without pressure, the surface is flat and smooth, precision, miniaturization tolerances can also achieve the desired requirements.